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JPEG Encoder By Quotes None 250 MHz 130 nm  
This IP core has been developed to be a complete standards compliant JPEG / MJPEG Hardware Compressor / Encoder. The data interfaces in the JPEG Encoder IP Core (JPEGE) use the AXI industry standard. The Master I/O data interfaces use an AXI3 bus, forward compatible with AXI4 interconnects. In order to let you assess the properties of the on-the-fly selectable quality setting, please use the slider below the image in order to see the final compressed image and compression ratio. The JPEG Encoder IP Core has a real throughput of two compressed pixels every three clock cycles at any compression ratio for a chroma subsampling of 4:2:0. To calculate the throughput for your platform. Introduction
JPEG Decoder By Quotes None 250 MHz 130 nm  
This JPEG Decoder IP core has been developed to be a complete standards compliant JPEG / MJPEG Hardware Decompressor / Decoder. When decoding JPEG images, pixel throughput can not be fixed for compressed JPEGs of arbitrary quality, as it depends on the compression ratio (bits needed to encode one pixel). To circumvent this limitation JPEG Decoder IP features a dual pixel component pipeline, allowing for greater decoding speeds.   Introduction
10/100/1000 Ethernet Media Access Controller By Quotes None 125 MHz 130 nm  
The MAC-1G/MAC is a synthesizable HDL core of a high-speed LAN controller. It implements Carrier Sense  Multiple  Access  with  Collision  Detection  (CSMA/CD)  algorithms  defined  by  the  IEEE  802.3 standard for media access control over the 10Mbps, 100Mbps and 1Gbps Ethernet. Communication  with  an external  host  is implemented  via  a set  of Control  and Status  Registers  and the DMA controller for external shared RAM memory. For data transfers the MAC-1G/MAC operates as  a DMA master. It automatically fetches from transmit data buffers and stores receive data buffers into external RAM with minimum CPU intervention. The linked list management enables the use of various memory allocation schemes. There is an interface for external dual port RAMs serving as configurable FIFO memories and there are separate memories for transmit and receive processes. Using the FIFOs additionally isolates the MAC-1G/MAC from an external host and provides resolution in case of latency of an external bus.    Application Network Interface Cards (NICs)  Routers, switching hubs Introduction
0.13um Real Time Clock By Quotes None 32 KHz 130 nm  
The RTC is a 0.13μm Real-Time-Clock cell that provides multiple clocks.   This RTC provides an operating voltage range of 2.7V ~ 3.3V, and an operating junction temperature range of -40˚ ~ 125℃. Introduction
4.2V-to-1.2V DC/DC Converter By Quotes 40.000 K μm^2 1 MHz 130 nm  
The DCDC12 is a 0.13μm DC to DC converter in buck mode cell that converters input voltage to a smaller output voltage. The output voltage can be programmed from 1.05V to 1.3V.An external 10uH inductor is necessary. Introduction
4.2V-to-1.8V DC/DC Converter By Quotes 40.000 K μm^2 1 Hz 130 nm  
  The DCDC18 is a 0.13μm DC to DC converter in buck mode cell that converters input voltage to a smaller output voltage. The output voltage can be programmed from 1.65V to 1.9V.An external 10uH inductor is necessary.  Introduction
PLL with Multiple Output Frequency By Quotes 40.000 K μm^2 12.156 MHz 130 nm  
  The PLL is a 0.13μm Phase-Locked Loop (PLL) cell that provides a clock multiplier that can generate a stable 48M/96M/120MHz/156MHz clock from a 12MHz clock source.  This is a “generic” PLL which integrates the Voltage-Controlled Oscillator (VCO), Phase-Frequency Detector, Low Pass Filter, Loop Divider and Post Divider.   This PLL provides an operating voltage range of 1.08V ~ 1.32V, and an operating junction temperature range of -40˚ ~ 125℃.  Introduction
300 mA Capless LDO in 130 nm (VLDS0300LS130) By Quotes None None 130 nm  
Power Quencher® Capless LDO (Silicon-proven 130 nm, 300 mA, excellent quiescent current and load transient regulation) The Power Quencher® series of fully-integrated low dropout (LDO) voltage regulators operates with ultra-low levels of power consumption without sacrificing other areas of performance. They achieve a low-noise output voltage and do not require the external output capacitor that is typically needed in an LDO for loop stability and noise reduction. This saves component count, board space and cost, and improves overall system reliability. The Power Quencher® LDO voltage regulator IP cores are optimized for integration into Application Specific Integrated Circuits (ASICs) or Systems-on-a-Chip (SoCs), including radio frequency (RF), wireless, and Internet of Things (IoT) applications. Introduction
Ultra-High Accuracy Bandgap Reference in 130 nm (VBRS1000NT130) By Quotes None None 130 nm  
ACCUREF™ Bandgap Reference (Silicon-proven 40 nm, low-power, low-noise, ultra-precise single-digit mV accuracy, no external components required) ACCUREF™ Voltage and Current References: This series of low-power, low-noise IP cores generates a precise, adjustable reference voltage with single-digit millivolt (mV) accuracy over a wide temperature range without external components. With their unique design that improves upon current products by allowing the systems to operate with ultra-low levels of power consumption without sacrificing accuracy or noise performance, our family of ACCUREF™ voltage and current reference IP cores support a broad range of industry applications with improved efficiency and remarkable area savings overall. Introduction
[110nm] 10-bit 165 MSPS ADC IP 70000 Points 210.000 K μm^2 165 MHz 110 nm  
UIP_ADC10_165M_213779 is an ultra-compact and very low power analog-to-digital converter (ADC) silicon IP. The 10-bit 165 MSPS ADC includes an internal custom bandgap voltage reference. It is capable of supplying bias currents to other parallel ADCs.   The ADC uses fully differential pipeline architecture with custom low-disturbance digital correction technique which allows single supply bus for both digital and analog. The ADC is designed for high dynamic performance for input frequencies up to Nyquist. This makes the IP perfectly suitable for video, imaging and communication appliances.   The IP is available in different metal options as well as deep N-well (DNW) option for SoC with high level of substrate noise. It consumes only 48mW at 165 MSPS operation and requires silicon area of 0.21 mm2. The IP does not require any external decoupling and is ideal for integration in mixed-signal systems. The output data of ADC is available in 2’s complement format.   UIP_ADC10_165M_213779 can be used in the following applications:   ‧Digital imaging ‧TV/Video ‧Wireless LAN ‧Rx communication channel ‧IOT Introduction
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